Memory device with a clocking mechanism

ABSTRACT

A memory device includes a first data driver configured to send a first data according to a first clock signal; a first data port electrically coupled to the first data driver, the first data port configured to receive the first data; a second data driver configured to send a second data according to a second clock signal, wherein the second clock signal does not match the first clock signal; and a second data port electrically coupled to the second data driver, the second data port configured to receive the second data.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/977,125, filed May 11, 2018, which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The disclosed embodiments relate to memory devices, and, in particular,to memory devices with a clocking mechanism.

BACKGROUND

Memory systems can employ memory devices to store and accessinformation. The memory devices can include volatile memory devices,non-volatile memory devices, or a combination device. Memory devices,such as dynamic random access memory (DRAM), can utilize electricalenergy to store and access data.

Due to circuit-component specifications, circuit design, etc., someperformance or characteristics of the memory devices can vary greatlyaccording to environmental and/or conditional factors. For example, asignal propagation time and/or a corresponding delay can vary based on acircuit layout (e.g., a distance between a source and a destination fordata signals, a relative location of data lines and correspondingcapacitances, etc.).

In view of the ever-increasing commercial competitive pressures, alongwith growing consumer expectations and the desire to differentiateproducts in the marketplace, it is increasingly desirable that answersbe found to these problems. Additionally, the need to reduce costs,improve efficiencies and performance, and meet competitive pressuresadds an even greater pressure to find answers to these problems.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a memory device in accordance with anembodiment of the present technology.

FIG. 2 illustrates a block diagram of an example data communicationcircuit in accordance with an embodiment of the present technology.

FIG. 3 illustrates a detailed block diagram of an example datacommunication circuit in accordance with an embodiment of the presenttechnology.

FIG. 4A illustrates a set of adjacent communication circuits inaccordance with an embodiment of the present technology.

FIG. 4B illustrates a timing diagram for negatively coupled signals sentthrough the set of adjacent communication circuits in accordance with anembodiment of the present technology.

FIG. 4C illustrates a timing diagram for neutrally coupled signals sentthrough the set of adjacent communication circuits in accordance with anembodiment of the present technology.

FIG. 4D illustrates a timing diagram for positively coupled signals sentthrough the set of adjacent communication circuits in accordance with anembodiment of the present technology.

FIG. 5 illustrates a timing diagram for a pair of adjacent communicationcircuits in accordance with an embodiment of the present technology.

FIG. 6 is a flow diagram illustrating an example method of operating thememory device of FIG. 1 in accordance with an embodiment of the presenttechnology.

FIG. 7 is a flow diagram illustrating an example method of manufacturingthe memory device of FIG. 1 in accordance with an embodiment of thepresent technology.

FIG. 8 is a schematic view of a system that includes a memory device inaccordance with an embodiment of the present technology.

DETAILED DESCRIPTION

As described in greater detail below, the technology disclosed hereinrelates to memory devices, systems with memory devices, and relatedmethods for dynamically managing initiation of data streams. The memorydevices (e.g., DRAM devices) can include a clocking mechanism configuredto provide different clock signals (e.g., data clocks) to minimize theeffect of propagation delay, fringing capacitance, etc. on access time.

For example, the memory device can use a first clock signal to control afirst set of drivers that send data signals to a first set of dataports. The memory device can use a second clock signal to control asecond set of drivers that send data signals to a second set of dataports. The arrival times between the data communicated over the firstset of circuit and the second set of circuit can differ (e.g., differentpropagation delays) according to a variety of factors. In someembodiments, the second data ports can be further from the drivers thanthe first data ports. In some embodiments, the second communicationcircuit can include additional repeaters, buffers, signal amplifiers,etc. that are not present in the first communication circuit. In someembodiments, the layout or relative locations of the first and/or secondcommunication circuits can introduce fringing capacitances between themetal routes of the communication circuits.

The memory device can account for the different propagation delays basedon using different clock signals. For example, the memory device cangenerate the first clocking signal based on delaying the second clockingsignal by a delay duration. The delay duration can be based on aseparation distance between the first data ports and the second dataports (e.g., the additional distance traveled by the communicationsignals), a delay characteristic of circuit components (e.g., repeaters,buffers, signal amplifiers, etc.), a magnitude of the fringingcapacitances, etc. The delay duration can also be based on signalcoupling scenarios and the corresponding propagation delays.

FIG. 1 is a block diagram of a memory device 100 (e.g., a semiconductormemory device, such as a DRAM device) in accordance with an embodimentof the present technology. The memory device 100 may include an array ofmemory cells, such as memory array 150. The memory array 150 may includea plurality of banks (e.g., banks 0-15 in the example of FIG. 1), andeach bank may include a plurality of word lines (WL), a plurality of bitlines (BL), and a plurality of memory cells arranged at intersections ofthe word lines and the bit lines. Memory cells can include any one of anumber of different memory media types, including capacitive,magnetoresistive, ferroelectric, phase change, or the like. Theselection of a word line WL may be performed by a row decoder 140, andthe selection of a bit line BL may be performed by a column decoder 145.Sense amplifiers (SAMP) may be provided for corresponding bit lines BLand connected to at least one respective local I/O line pair (LIOT/B),which may in turn be coupled to at least respective one main I/O linepair (MIOT/B), via transfer gates (TG), which can function as switches.The memory array 150 may also include plate lines and correspondingcircuitry for managing their operation.

The memory device 100 may employ a plurality of external terminals thatinclude command and address terminals coupled to a command bus and anaddress bus to receive command signals CMD and address signals ADDR,respectively. The memory device may further include a chip selectterminal to receive a chip select signal CS, clock terminals to receiveclock signals CK and CKF, data clock terminals to receive data clocksignals WCK and WCKF, data terminals DQ, RDQS, DBI, and DMI, powersupply terminals VDD, VSS, VDDQ, and VSSQ.

The command terminals and address terminals may be supplied with anaddress signal and a bank address signal from outside. The addresssignal and the bank address signal supplied to the address terminals canbe transferred, via a command/address input circuit 105, to an addressdecoder 110. The address decoder 110 can receive the address signals andsupply a decoded row address signal (XADD) to the row decoder 140, and adecoded column address signal (YADD) to the column decoder 145. Theaddress decoder 110 can also receive the bank address signal (BADD) andsupply the bank address signal to both the row decoder 140 and thecolumn decoder 145.

The command and address terminals may be supplied with command signalsCMD, address signals ADDR, and chip selection signals CS, from a memorycontroller. The command signals may represent various memory commandsfrom the memory controller (e.g., including access commands, which caninclude read commands and write commands). The select signal CS may beused to select the memory device 100 to respond to commands andaddresses provided to the command and address terminals. When an activeCS signal is provided to the memory device 100, the commands andaddresses can be decoded and memory operations can be performed. Thecommand signals CMD may be provided as internal command signals ICMD toa command decoder 115 via the command/address input circuit 105. Thecommand decoder 115 may include circuits to decode the internal commandsignals ICMD to generate various internal signals and commands forperforming memory operations, for example, a row command signal toselect a word line and a column command signal to select a bit line. Theinternal command signals can also include output and input activationcommands, such as clocked command CMDCK. The command decoder 115 mayfurther include one or more registers 117 for tracking various counts orvalues (e.g., counts of refresh commands received by the memory device100 or self-refresh operations performed by the memory device 100).

When a read command is issued and a row address and a column address aretimely supplied with the read command, read data can be read from memorycells in the memory array 150 designated by these row address and columnaddress. The read command may be received by the command decoder 115,which can provide internal commands to input/output circuit 160 so thatread data can be output from the data terminals DQ, RDQS, DBI, and DMIvia read/write amplifiers 155 and the input/output circuit 160 accordingto the RDQS clock signals. The read data may be provided at a timedefined by read latency information RL that can be programmed in thememory device 100, for example, in a mode register (not shown in FIG.1). The read latency information RL can be defined in terms of clockcycles of the CK clock signal. For example, the read latency informationRL can be a number of clock cycles of the CK signal after the readcommand is received by the memory device 100 when the associated readdata is provided.

When a write command is issued and a row address and a column addressare timely supplied with the command, write data can be supplied to thedata terminals DQ, DBI, and DMI according to the WCK and WCKF clocksignals. The write command may be received by the command decoder 115,which can provide internal commands to the input/output circuit 160 sothat the write data can be received by data receivers in theinput/output circuit 160, and supplied via the input/output circuit 160and the read/write amplifiers 155 to the memory array 150. The writedata may be written in the memory cell designated by the row address andthe column address. The write data may be provided to the data terminalsat a time that is defined by write latency WL information. The writelatency WL information can be programmed in the memory device 100, forexample, in the mode register (not shown in FIG. 1). The write latencyWL information can be defined in terms of clock cycles of the CK clocksignal. For example, the write latency information WL can be a number ofclock cycles of the CK signal after the write command is received by thememory device 100 when the associated write data is received.

The power supply terminals may be supplied with power supply potentialsVDD and VSS. These power supply potentials VDD and VSS can be suppliedto an internal voltage generator circuit 170. The internal voltagegenerator circuit 170 can generate various internal potentials VPP, VOD,VARY, VPERI, and the like based on the power supply potentials VDD andVSS. The internal potential VPP can be used in the row decoder 140, theinternal potentials VOD and VARY can be used in the sense amplifiersincluded in the memory array 150, and the internal potential VPERI canbe used in many other circuit blocks.

The power supply terminal may also be supplied with power supplypotential VDDQ. The power supply potential VDDQ can be supplied to theinput/output circuit 160 together with the power supply potential VSS.The power supply potential VDDQ can be the same potential as the powersupply potential VDD in an embodiment of the present technology. Thepower supply potential VDDQ can be a different potential from the powersupply potential VDD in another embodiment of the present technology.However, the dedicated power supply potential VDDQ can be used for theinput/output circuit 160 so that power supply noise generated by theinput/output circuit 160 does not propagate to the other circuit blocks.

The clock terminals and data clock terminals may be supplied withexternal clock signals and complementary external clock signals. Theexternal clock signals CK, CKF, WCK, WCKF can be supplied to a clockinput circuit 120. The CK and CKF signals can be complementary, and theWCK and WCKF signals can also be complementary. Complementary clocksignals can have opposite clock levels and transition between theopposite clock levels at the same time. For example, when a clock signalis at a low clock level a complementary clock signal is at a high level,and when the clock signal is at a high clock level the complementaryclock signal is at a low clock level. Moreover, when the clock signaltransitions from the low clock level to the high clock level thecomplementary clock signal transitions from the high clock level to thelow clock level, and when the clock signal transitions from the highclock level to the low clock level the complementary clock signaltransitions from the low clock level to the high clock level.

Input buffers included in the clock input circuit 120 can receive theexternal clock signals. For example, when enabled by a CKE signal fromthe command decoder 115, an input buffer can receive the CK and CKFsignals and the WCK and WCKF signals. The clock input circuit 120 canreceive the external clock signals to generate internal clock signalsICLK. The internal clock signals ICLK can be supplied to an internalclock circuit 130. The internal clock circuit 130 can provide variousphase and frequency controlled internal clock signal based on thereceived internal clock signals ICLK and a clock enable signal CKE fromthe command/address input circuit 105. For example, the internal clockcircuit 130 can include a clock path (not shown in FIG. 1) that receivesthe internal clock signal ICLK and provides various clock signals to thecommand decoder 115. The internal clock circuit 130 can further provideinput/output (IO) clock signals. The IO clock signals can be supplied tothe input/output circuit 160 and can be used as a timing signal fordetermining an output timing of read data and the input timing of writedata. The IO clock signals can be provided at multiple clock frequenciesso that data can be output from and input to the memory device 100 atdifferent data rates. A higher clock frequency may be desirable whenhigh memory speed is desired. A lower clock frequency may be desirablewhen lower power consumption is desired. The internal clock signals ICLKcan also be supplied to a timing generator 135 and thus various internalclock signals can be generated.

The memory device 100 can be connected to any one of a number ofelectronic devices capable of utilizing memory for the temporary orpersistent storage of information, or a component thereof. For example,a host device of memory device 100 may be a computing device such as adesktop or portable computer, a server, a hand-held device (e.g., amobile phone, a tablet, a digital reader, a digital media player), orsome component thereof (e.g., a central processing unit, a co-processor,a dedicated memory controller, etc.). The host device may be anetworking device (e.g., a switch, a router, etc.) or a recorder ofdigital images, audio and/or video, a vehicle, an appliance, a toy, orany one of a number of other products. In one embodiment, the hostdevice may be connected directly to memory device 100, although in otherembodiments, the host device may be indirectly connected to memorydevice (e.g., over a networked connection or through intermediarydevices).

Through the connection, the memory device 100 can exchange data withother devices or circuits. For example, the memory device 100 can accessthe data stored in the memory array 150 and send it through the DQ dataterminals. The data access/communication can correspond to an accesstime (e.g., an amount of time needed to get stable output after a changein address, ‘Taa’) and/or column-to-column delay (e.g., a minimum amountof time between column operations, ‘Tccd’). The access time and/or thecolumn-to-column delay can correspond to an amount of time necessary tosend the data from the memory array 150 to the corresponding port (e.g.,represented as ‘DQ’ from the input/output circuit 160). For example, theaccess time and/or the column-to-column delay may have to account forworst-case propagation delay between the memory array 150 and the DQports.

However, by utilizing different clock signals, the memory device 100 canaccount for the different propagation delays, such as across differentDQ communication lines/circuits and/or across different signaltransitions, and improve the access time and the column-to-column delay.For example, the memory device 100 can use a reference clock signal forcircuits that experience longer propagation delays due to longerphysical length in the traces, additional buffers/repeaters in thecircuit, fringing capacitances due to adjacent communication lines, etc.For other circuits, such as ones that have short traces between thearray and the DQ ports, that have less or no buffers/repeaters in thecircuit, that experience less or no fringing capacitances, etc., thememory device 100 can use a delayed clock signal. The delay amount canbe based on the contributing factors.

FIG. 2 illustrates a block diagram of an example data communicationcircuit 200 in accordance with an embodiment of the present technology.The data communication circuit 200 can illustrate the circuit betweenthe memory array 150 of FIG .1 and the input/output circuit 160 of FIG.1 (e.g., the DQ ports).

In some embodiments, the memory device 100 of FIG. 1 can include a datajunction 202 that includes a first driver set 204, a second driver set206, etc. The data junction 202 can be a physical portion of the memorydevice 100 (e.g., a silicon die or a chip). For example, the datajunction 202 can be a center/middle portion of the silicon die/chip thatis near/under/over the data array.

The first driver set 204 and the second driver set 206 can includetransmitters/driver circuits configured to send data to connectedports/circuit components. The first driver set 204 can be connected to afirst set of data ports 214 through first data lines 224, and the seconddriver set 206 can be connected to a second set of data ports 216through second data lines 226. In some embodiments, the first data lines224 and the second data lines 226 can be interleaved as illustrated inFIG. 2. In some embodiments, the first data ports 214 and the seconddata ports 216 can be physically located at different location/regionson the die/chip, separated by a port separation distance 232.Accordingly, a distance from the data junction 202 to the second dataports 216 can be farther by the port separation distance 232 (e.g.,1-5000 μm) in comparison to a distance from the data junction 202 to thefirst data ports 214. In some embodiments, the communication circuit 200can include a data buffer module 218 between the data junction 202 andthe second data ports 216.

Due to the physical arrangement of the communication lines, the datacommunication circuit 200 can include fringing capacitance 228 betweenadjacent communication lines (e.g., traces). For example,adjacent/parallel metal traces can be separated by an electricalinsulator, and due to such arrangement, act as a capacitor.

The fringing capacitance 228 can affect (e.g., increase) propagation ofsignal through the data lines (e.g., the first data lines 224, thesecond data lines 226, etc.). In addition, the data buffer 218, the portseparation distance 232, etc. can affect the propagation of the signal.As illustrated in FIG. 2, signals traveling to the second data ports 216can experience greater propagation delay. Accordingly, forsimultaneously transmitted signals (e.g., from both the first driver set204 and the second driver set 206), data can arrive later at the seconddata ports 216 than at the first data ports 214.

To account for such differences in propagation delays across thecommunication paths, the data communication circuit 200 use differentclock signals for each communication path. For example, the firstcommunication circuit (e.g., from the first driver set 204 to the firstdata ports 214) can operate based on one or more first clock inputs 252,and the second communication circuit (e.g., from the second driver set206 to the second data ports 216) can operate based on one or moresecond clock inputs 254. The data communication circuit 200 can includea delay module 256 configured to generate the first clock inputs 252,the second clock inputs 254, etc. In some embodiments, the delay module256 can generate the first clock inputs 252 based on delaying the secondclock inputs 254 by a delay duration 258.

FIG. 3 illustrates a detailed block diagram of an example datacommunication circuit 300 in accordance with an embodiment of thepresent technology. The data communication circuit 300 can be a portionof the data communication circuit 200 of FIG. 2. For example, the datacommunication circuit 300 can include a first circuit 302 including aconnection (e.g., a first line 324) between one of the drivers (e.g., afirst driver 304) in the first driver set 204 of FIG. 2 and one of theports (e.g., a first port 314) in the first data ports 214 of FIG. 2.The first circuit 302 can be used to communicate first data 334. Also,the data communication circuit 300 can include a second circuit 303including a connection (e.g., a second line 326) between one of thedrivers (e.g., a second driver 306) in the second driver set 206 of FIG.2 and one of the ports (e.g., a second port 316) in the second dataports 216 of FIG. 2. The second circuit 303 can further include a buffer318 between the second driver 306 and the second port 316. The secondcircuit 303 can be used to communicate second data 336.

As discussed above, the first data 334 can experience less propagationdelay through the first circuit 302 than the second data 336communicated through the second circuit 303. The increased propagationdelay for the second circuit 303 can be based on the port separationdistance 232, the buffer 318, a shape or a relationship between thesecond data 336 and data (e.g., the first data 334) communicated onother adjacent data lines.

As illustrated in FIG. 3, the delay module 256 can control atransmission timing of the first data 334 and the second data 336. Insome embodiments, the delay module 256 can generate a first clock signal352 that controls the transmission timing of the first data 334. Thedelay module 256 can generate the first clock signal 352 based on asecond clock signal 354 that is configured to control the transmissiontiming of the second data 336. For example, the delay module 256 cangenerate the first clock signal 352 based on delaying the second clocksignal 354 according to the delay duration 258. Accordingly, the firstdata 334 can be transmitted after the delay duration 258 followingtransmission of the second data 336.

Using multiple clock signals (e.g., the first clock signal 352 and thesecond clock signal 354) instead of a common clock signal can improvepropagation delay for the memory device 100 and related performancecharacteristics (e.g., the access time, the column-to-column delay,etc.). Accordingly, the electronic device can reduce an amount ofvariation in signal arrival times across different communicationcircuits, thereby increasing uniformity in data communication acrossdifferent locations/portions of the die.

FIG. 4A illustrates a set of adjacent communication circuits inaccordance with an embodiment of the present technology. The adjacentcommunication circuits can be a portion of the data communicationcircuit 200 of FIG. 2. FIG. 4A can illustrate a reference circuit 404(e.g., the second circuit 303 of FIG. 3) that includes its driver, dataline, and/or a portion thereof physically located between that/those ofa first adjacent circuit 408 (e.g., an instance of the first circuit 302of FIG. 3) and a second adjacent circuit 409 (e.g., a different instanceof the first circuit 302 of FIG. 3).

FIGS. 4B-4D illustrate propagation delays corresponding to differentsignal combinations between adjacent communication lines/circuits. Basedto the fringing capacitance 228 of FIG. 2, the data signal in thereference circuit 404 can be affected by the data signals in the firstadjacent circuit 408 and/or the second adjacent circuit 409. Also,different combination of the signal levels/transitions between theadjacent lines can affect a signal arrival time or a propagation delay.For example, the data can arrive at a data destination 406 after adifferent amount of propagation delay that depend on relativeshapes/transitions of the adjacent circuits. FIGS. 4B-4D illustratedifferent shape/transition combinations of a reference signal 414communicated over the reference circuit 404, a first signal 418communicated over the first adjacent circuit 408, and a second signal419 communicated over the second adjacent circuit 409. Further, FIGS.4B-4D illustrate a received signal 416 representing the reference signal414 received or arriving at the data destination 406.

FIG. 4B illustrates a negative coupling scenario 420. The negativecoupling scenario 420 can include the reference signal 414 having ashape/transition different or opposite of shapes/transitions of signals(e.g., the first signal 418 and the second signal 419) communicated overthe adjacent circuits (e.g., the first adjacent circuit 408 and thesecond adjacent circuit 409). For example, when the reference signal 414includes a high-to-low transition, both the first signal 418 and thesecond signal 419 can include low-to-high transitions.

For the negative coupling scenario 420, the received signal 416 can bedelayed from transmission of the reference signal 414 by anegative-coupling delay 422. The negative-coupling delay 422 (‘T+α’) caninclude a base propagation delay (‘T’) caused by a trace length/size, abuffer/repeater in the circuit, etc. and a coupling delay (‘α’) causedby the negative coupling scenario 420. In some embodiments, the couplingdelay can be 1 pico second or greater.

FIG. 4C illustrates a neutral coupling scenario 430. The neutralcoupling scenario 430 can include the reference signal 414 having ashape/transition matching that of one of the signals communicated overthe adjacent circuits. For example, when the reference signal 414includes a high-to-low transition, the first signal 418 can include alow-to-high transition and the second signal 419 can include ahigh-to-low transition or vice versa.

For the neutral coupling scenario 430, the received signal 416 can bedelayed from transmission of the reference signal 414 by aneutral-coupling delay 432. The neutral-coupling delay 432 (‘T’) caninclude the base propagation delay. For the neutral coupling scenario430, the coupling delay (‘α’) can be absent.

FIG. 4D illustrates a positive coupling scenario 440. The positivecoupling scenario 440 can include the reference signal 414 having ashape/transition matching shapes/transitions of signals (e.g., the firstsignal 418 and the second signal 419) communicated over the adjacentcircuits (e.g., the first adjacent circuit 408 and the second adjacentcircuit 409). For example, when the reference signal 414 includes ahigh-to-low transition, both the first signal 418 and the second signal419 can include high-to-low transitions.

For the positive coupling scenario 440, the received signal 416 can bedelayed from transmission of the reference signal 414 by apositive-coupling delay 442. The positive-coupling delay 442 (‘T−β’) caninclude the base propagation delay (‘T’) reduced by the coupling delay(‘β’). In some embodiments, the coupling delay can be 1 pico second orgreater. In some embodiments, the coupling delay (‘β’) of the positivecoupling scenario 440 can be equal to the coupling delay (‘α’) of thenegative coupling scenario 420.

FIG. 5 illustrates a timing diagram for a pair of adjacent communicationcircuits in accordance with an embodiment of the present technology.Instead of simultaneously transmitting signals across adjacent circuits,as exemplified in FIGS. 4B-4D, the memory device 100 of FIG. 1 can delayone of the signals. For example, the delay module 256 of FIG. 2 cangenerate the first clock inputs 252 or the first clock signal 352 basedon delaying the second clock inputs 254 or the second clock signal 354by the delay duration 258. Accordingly, the first data 334 can betransmitted later/after the second data 336 by the delay duration 258.

As such, using the offset timing signals, the memory device 100 canavoid the various coupling scenarios (e.g., the negative couplingscenario 420, the neutral coupling scenario 430, the positive couplingscenario 440, etc., all of FIG. 4) and their corresponding effects onthe propagation delay. Accordingly, the offset timing signals can reducethe variance in the propagation delay and improve the timingcharacteristics (e.g., the access time, the column-to-column delay,etc.) for the memory device 100. Also, the offset timing signals canprovide the benefits without using shields between data lines, and assuch, can provide the benefits without devoting die space for theshields.

In some embodiments, the delay duration 258 can be based on a longestpropagation delay and a shortest propagation delay. For example, thedelay duration 258 can be between the negative-coupling delay 422 andthe positive-coupling delay 442. Also, the delay duration 258 can bebased on or equal to the neutral-coupling delay 432. The delay duration258 can be a delay amount associated with the buffers, a delay amountassociated with the port separation distance 232 of FIG. 2. The delayduration 258 can be between 1-1000 pico seconds.

FIG. 6 is a flow diagram illustrating an example method 600 of operatingthe memory device 100 of FIG. 1 in accordance with an embodiment of thepresent technology. The method 600 can be for operating the datacommunication circuit 200 of FIG. 2, the data communication circuit 300of FIG. 3, etc. The method 600 can be for generating clock signals andsending data according to the clock signals.

At block 602, the memory device 100 (e.g., the delay module 256 of FIG.2) can generate the second clock inputs 254 of FIG. 2 (e.g., the secondclock signal 354 of FIG. 3) for driving the second driver set 206 ofFIG. 2 (e.g., the second driver 306 of FIG. 3). The memory device 100can generate the clock signals for operating the communication circuitscorresponding to longer/longest propagation delay. For example, thememory device 100 can generate the clock signals configured to drive thedrivers coupled to the farthest data port (i.e., relative to the datajunction 202 of FIG. 2 including the drivers), including the data buffer218 of FIG. 2, etc.

At block 604, the memory device 100 (e.g., the delay module 256) cangenerate the first clock inputs 252 of FIG. 2 (e.g., the first clocksignal 352 of FIG. 3) for driving the first driver set 204 of FIG. 2(e.g., the first driver 304 of FIG. 3). The memory device 100 cangenerate the clock signals for operating the communication circuitscorresponding to shorter/shortest propagation delay. For example, thememory device 100 can generate the clock signals configured to drive thedrivers coupled to the nearer/nearest data port, including less or nonethe data buffer 218 of FIG. 2, etc.

The memory device 100 can generate the first clock inputs 252 offsetfrom the second clock inputs 254. For example, at block 614, the memorydevice 100 can generate the first clock inputs 252 by delaying thesecond clock inputs 254. The delay module 256 can receive the secondclock inputs 254 as inputs. Based on the input, the delay module 256 cangenerate the first clock inputs 252 according to the delay duration 258of FIG. 1. In some embodiments, the delay module 256 can generate thefirst clock inputs 252 based on delaying the second clock inputs 254 bythe delay duration 258. Accordingly, the first clock inputs 252 can bedelayed from the second clock inputs 254 by the delay duration 258.

In generating the delayed clock signals, the memory device 100 can usethe delay duration 258 that corresponds to one or more characteristicsof communication circuits. For example, the memory device 100 can delaythe signal according to a propagation delay caused by the fringingcapacitance 228 of FIG. 2 associated with physical configuration of thedata lines (e.g., the first data lines 224 of FIG. 2, the second datalines 226 of FIG. 2, etc.). Also, the memory device 100 can delay thesignal according to a propagation delay caused by the data buffer 218 inthe communication circuit. Also, the memory device 100 can delay thesignal according to a propagation delay associated with the portseparation distance 232 of FIG. 2.

At blocks 622 and 624, the memory device 100 (e.g., the first driver set204, the second driver set 206, etc.) can generate data according to theseparate clock signals. At block 622, the memory device 100 can generatethe second data 336 of FIG. 3 according to the second clock inputs 254.At block 624, the memory device 100 can generate the first data 334 ofFIG. 3 according to the first clock inputs 252. In other words, thefirst clock inputs 252 (e.g., the first clock signal 352) can triggertransmission of the first data 334 to the first data ports 214 of FIG. 2(e.g., the first port 314 of FIG. 3), and the second clock inputs 254(e.g., the second clock signal 354) can trigger transmission of thesecond data 336 to the second data ports 216 of FIG. 2 (e.g., the secondport 316 of FIG. 3). Accordingly, the first data 334 can be sent offsetfrom (e.g., after) the second data 336 instead of using the same clocksignal to simultaneous send data over different circuits. The delaybetween the data transmissions can be the delay duration 258.

FIG. 7 is a flow diagram illustrating an example method 700 ofmanufacturing the memory device 100 of FIG. 1 in accordance with anembodiment of the present technology. The method 700 can be formanufacturing the memory device 100 to implement multipledifferent/delayed clock signals and corresponding offset datatransmissions.

The method 700, such as at block 702, can include determining circuitcharacteristics of a first communication circuit (e.g., the firstcircuit 302 of FIG. 3). In some embodiments, the circuit characteristicscan include location on the memory device 100 of data ports configuredto receive data from corresponding drivers. For example, at block 712,locations of the first data ports 214 of FIG. 2 can be determined. Insome embodiments, the locations can be determined based on thelayout/design of the memory device 100. In some embodiments, thelocations can be measured using outside tools or estimated usingpredetermined methods.

At block 704, circuit characteristics of a second communication circuit(e.g., the second circuit 303 of FIG. 3) can be determined. For example,at block 742, locations of the second data ports 216 of FIG. 2 can bedetermined. The locations can be determined similarly as describedabove.

The method 700 can include determination of other circuitcharacteristics in addition to or separate from the port locations. Forexample, at block 744, buffer delays can be determined. Each buffer orcombination of buffers can correspond to a known or measurable amount ofdelay. Accordingly, determination of the buffer delays can includeidentification of the buffers in each circuit and accessing/lookingup/measuring the time delays associated with the buffers.

At block 746, the port separation distance 232 of FIG. 2 can becalculated. The port separation distance 232 can be calculated inreference to the data junction 202 of FIG. 2 including the drivers. Theport separation distance 232 can be calculated based on calculating adifference in lengths of the first data lines 224 of FIG. 2 and thesecond data lines 226 of FIG. 2.

At block 748, the fringing capacitance 228 of FIG. 2 can be determined.In some embodiments, the fringing capacitance 228 can becalculated/estimated based on a separation distance between the datalines, the insulation material between the data lines, etc. In someembodiments, the fringing capacitance 228 can be measured.

At block 750, the signal-coupling delays (e.g., the negative-couplingdelay 422, the neutral-coupling delay 432, the positive-coupling delay442, all of FIG. 4, etc.) can be determined. The signal-coupling delayscan be determined based on the fringing capacitance 228 or similarly asthe fringing capacitance 228.

At block 706, the delay duration 258 of FIG. 2 can be calculated basedon one or more of the circuit characteristics. In some embodiments, thedelay duration 258 can be calculated based on combining (e.g., adding orcombining according to a predetermined equation/method) the delayamounts caused by the characteristics of the corresponding circuit. Forexample, the delay duration 258 can be calculated based on the firstport location and the second port location, etc. Also, the delayduration 258 can be calculated based on the fringing capacitance 228,the buffer delay, the port separation distance 232, etc.

In some embodiments, the delay duration 258 can be calculated accordingto worst and/or best case propagation scenarios for the communicationcircuits. For example, the delay duration 258 can be calculated to begreater than the positive-coupling delay 442 associated with thepositive coupling scenario 440, less than the negative-coupling delay422 associated with the negative coupling scenario 420, etc. In someembodiments, the delay duration 258 can be calculated based on, such asmatching or adjusting, the neutral-coupling delay 432 associated withthe neutral coupling scenario 430. In some embodiments, the delayduration 258 can be calculated based on a predetermined method/equationthat uses the positive-coupling delay 442, the negative-coupling delay422, the neutral-coupling delay 432, or a combination thereof.

At block 708, the memory device 100 can be configured to implement thedelay duration 258 in generating separate/offset clock signals. Forexample, circuitry, software, or firmware for the delay module 256 ofFIG. 2 can be set according to the delay duration 258.

FIG. 8 is a schematic view of a system that includes a memory device inaccordance with embodiments of the present technology. Any one of theforegoing memory devices described above with reference to FIGS. 1-7 canbe incorporated into any of a myriad of larger and/or more complexsystems, a representative example of which is system 880 shownschematically in FIG. 8. The system 880 can include a memory device 800,a power source 882, a driver 884, a processor 886, and/or othersubsystems or components 888. The memory device 800 can include featuresgenerally similar to those of the memory device described above withreference to FIGS. 1-7, and can therefore include various features forperforming a direct read request from a host device. The resultingsystem 880 can perform any of a wide variety of functions, such asmemory storage, data processing, and/or other suitable functions.Accordingly, representative systems 880 can include, without limitation,hand-held devices (e.g., mobile phones, tablets, digital readers, anddigital audio players), computers, vehicles, appliances and otherproducts. Components of the system 880 may be housed in a single unit ordistributed over multiple, interconnected units (e.g., through acommunications network). The components of the system 880 can alsoinclude remote devices and any of a wide variety of computer readablemedia.

From the foregoing, it will be appreciated that specific embodiments ofthe technology have been described herein for purposes of illustration,but that various modifications may be made without deviating from thedisclosure. In addition, certain aspects of the new technology describedin the context of particular embodiments may also be combined oreliminated in other embodiments. Moreover, although advantagesassociated with certain embodiments of the new technology have beendescribed in the context of those embodiments, other embodiments mayalso exhibit such advantages and not all embodiments need necessarilyexhibit such advantages to fall within the scope of the technology.Accordingly, the disclosure and associated technology can encompassother embodiments not expressly shown or described herein.

In the illustrated embodiments above, the memory devices have beendescribed in the context of DRAM devices. Memory devices configured inaccordance with other embodiments of the present technology, however,can include other types of suitable storage media in addition to or inlieu of DRAM devices, such as, devices incorporating NAND-based orNOR-based non-volatile storage media (e.g., NAND flash), magneticstorage media, phase-change storage media, ferroelectric storage media,etc.

The term “processing” as used herein includes manipulating signals anddata, such as writing or programming, reading, erasing, refreshing,adjusting or changing values, calculating results, executinginstructions, assembling, transferring, and/or manipulating datastructures. The term data structures includes information arranged asbits, words or code-words, blocks, files, input data, system generateddata, such as calculated or generated data, and program data. Further,the term “dynamic” as used herein describes processes, functions,actions or implementation occurring during operation, usage ordeployment of a corresponding device, system or embodiment, and after orwhile running manufacturer's or third-party firmware. The dynamicallyoccurring processes, functions, actions or implementations can occurafter or subsequent to design, manufacture, and initial testing, setupor configuration.

The above embodiments are described in sufficient detail to enable thoseskilled in the art to make and use the embodiments. A person skilled inthe relevant art, however, will understand that the technology may haveadditional embodiments and that the technology may be practiced withoutseveral of the details of the embodiments described above with referenceto FIGS. 1-8.

I/We claim:
 1. A memory device, comprising: a first data driverconfigured to send a first data according to a first clock signal; afirst data port electrically coupled to the first data driver, the firstdata port configured to receive the first data; a second data driverconfigured to send a second data according to a second clock signal,wherein: the second clock signal does not match the first clock signal,and a temporal relationship exists between the first clock signal andthe second clock signal, wherein the temporal relationship represents adifference in propagation delays associated with (1) signal combinationsbetween adjacent circuits, (2) distances between data drivers andcorresponding data ports, (3) retransmissions between the data driversand the corresponding data ports, (4) relative locations of the datadrivers and the corresponding data ports, or a combination thereof; anda second data port electrically coupled to the second data driver, thesecond data port configured to receive the second data.
 2. The memorydevice of claim 1, further comprising a delay module configured togenerate the first clock signal based on the second clock signal.
 3. Thememory device of claim 2, wherein the delay module is configured togenerate the first clock signal based on delaying the second clocksignal by a delay duration.
 4. The memory device of claim 3, furthercomprising: a first adjacent data line electrically coupling the firstdata driver to the first data port; a reference data line electricallycoupling the second data driver to the second data port; a secondadjacent circuit including a further driver coupled to a further portthrough a further data line; and wherein: the reference data line, thesecond data driver, or a combination thereof is located between thesecond adjacent circuit and a first adjacent circuit comprising thefirst data driver, the first data port, and the first adjacent dataline.
 5. The memory device of claim 4, wherein the delay duration isgreater than a positive-coupling delay associated with a positivecoupling scenario, wherein: the positive-coupling delay represents aduration between transmission of the second data and arrival of thesecond data at the second data port; and the positive coupling scenariocorresponds to the second data having a transition simultaneous withmatching transitions in the first data and data communicated in thesecond adjacent circuit.
 6. The memory device of claim 4, wherein thedelay duration is less than a negative-coupling delay associated with anegative coupling scenario, wherein: the negative-coupling delayrepresents a duration between transmission of the second data andarrival of the second data at the second data port; and the negativecoupling scenario corresponds to the second data having a transitionsimultaneous with differently shaped transitions in the first data anddata communicated in the second adjacent circuit.
 7. The memory deviceof claim 4, wherein the delay duration is based on a neutral-couplingdelay associated with a neutral coupling scenario, wherein: theneutral-coupling delay represents a duration between transmission of thesecond data and arrival of the second data at the second data port; andthe neutral coupling scenario corresponds to the second data having atransition simultaneous with one differently shaped transitions and onematching transition in the first data and data communicated in thesecond adjacent circuit.
 8. The memory device of claim 4, wherein thedelay duration is based on fringing capacitances associated withphysical configuration of the first adjacent circuit and the secondadjacent circuit relative to the reference data line, the second datadriver, or a combination thereof.
 9. The memory device of claim 3,wherein: a distance between the second data driver and the second dataport is greater than a distance between the first data driver and thefirst data port by a port separation distance; and the delay duration isbased on the port separation distance.
 10. The memory device of claim 9,further comprising: a first set of data lines having a first length andelectrically connecting a first set of drivers to a first set of dataports, wherein the first set of drivers include the first data driver;and a second set of data lines having a second length and electricallyconnecting a second set of drivers to a second set of data ports,wherein: the second set of drivers include the second data driver, thesecond length is greater than the first length by the port separationdistance, and the second set of data lines and the first set of datalines are interleaved.
 11. The memory device of claim 3, furthercomprising: a buffer between the second data driver and the second dataport, the buffer electrically coupled to the second data driver and thesecond data port and configured to receive and retransmit the seconddata; and wherein: the delay duration is associated with a timingcorresponding to the buffer.
 12. The memory device of claim 3, whereinthe delay duration is between 0.1 picosecond and 1000 picosecond. 13.The memory device of claim 1 comprises a dynamic random access memory(DRAM).
 14. The memory device of claim 1, wherein: the first data driverand the second data driver comprise a data junction located at a centerportion of the memory device; and the first data port and the seconddata port are located away from the data junction.
 15. A method ofoperating a memory device, the method comprising: generating a firstclock signal; sending first data from a first data driver to a firstdata port, wherein the first data is sent according to the first clocksignal; generating a second clock signal offset from the first clocksignal, wherein the offset represents a difference in propagation delaysassociated with (1) signal combinations between adjacent circuits, (2)distances between data drivers and corresponding data ports, (3)retransmissions between the data drivers and the corresponding dataports, (4) relative locations of the data drivers and the correspondingdata ports, or a combination thereof; and sending second data from asecond data driver to a second data port, wherein the second data issent according to the second clock signal and offset from the firstdata.
 16. The method of claim 15, wherein generating the first clocksignal includes generating the first clock signal based on delaying thesecond clock signal by a delay duration.
 17. The method of claim 16,wherein the delay duration corresponds to one or more characteristics ofcommunication circuits, wherein the one or more characteristics includefringing capacitances associated with physical configuration of datalines connecting data drivers to the data ports, a buffer between thesecond data driver and the second data port, a port separation distancerepresenting a difference in distances of the first and second dataports from the corresponding first and second data drivers, or acombination thereof.
 18. A method of operating a memory device, themethod comprising: determining a first pad location, wherein the firstpad location comprises a location on the memory device of a first dataport configured to receive a first data from a first driver; determininga second pad location, wherein the second pad location comprises alocation on the memory device of a second data port configured toreceive a second data from a second driver; calculating a delay durationbased on the first driver location and the second pad location, thedelay duration configured to differentiate a first clock signal from asecond clock signal, wherein: the delay duration represents a differencein propagation delays associated with (1) signal combinations betweenadjacent circuits, (2) distances between data drivers and correspondingdata ports, (3) retransmissions between the data drivers and thecorresponding data ports, (4) relative locations of the data drivers andthe corresponding data ports, or a combination thereof, the first clocksignal is configured to trigger transmission of the first data, and thesecond clock signal is configured to trigger transmission of the seconddata; and configuring a timing module to generate the first clock signaland the second clock signal according to the delay duration.
 19. Themethod of claim 18, wherein calculating the delay duration includescalculating the delay duration based on one or more characteristics ofcommunication circuits configured to communicate data, wherein the oneor more characteristics include fringing capacitances associated withphysical configuration of data lines connecting data drivers to the dataports, a buffer between the second data driver and the second data port,a port separation distance representing a difference in distances of thefirst and second data ports from the corresponding first and second datadrivers, or a combination thereof.
 20. The method of claim 18, whereincalculating the delay duration includes calculating the delay durationgreater than a positive-coupling delay associated with a positivecoupling scenario, less than a negative-coupling delay associated with anegative coupling scenario, or both, wherein: the positive-couplingdelay and the negative-coupling delay represent durations betweentransmission of the second data and arrival of the second data at thesecond data port for corresponding scenarios, the positive couplingscenario corresponds to the second data having a transition simultaneouswith matching transitions in the first data and data communicated in thesecond adjacent circuit, and the negative coupling scenario correspondsto the second data having a transition simultaneous with differentlyshaped transitions in the first data and data communicated in the secondadjacent circuit.